Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation

Author

Cervenka, Johann ; Fleischmann, Peter ; Selberherr, Siegfried ; Knaipp, Martin ; Unterleitner, Franz

Author_Institution

Technical University Vienna, Austria

fYear

2001

fDate

11-13 September 2001

Firstpage

227

Lastpage

230

Keywords

Breakdown voltage; Doping; Fingers; Ion implantation; MOSFETs; Microelectronics; Process design; Space charge; Surface resistance; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 2001. Proceeding of the 31st European

Print_ISBN

2-914601-01-8

Type

DOI

10.1109/ESSDERC.2001.195242

Filename

1506624

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