Development of Multi-Layer Liquid Crystal Polymer Ka-band Receiver Modules

We present the development of a Ka-band receiver module using liquid crystal polymer (LCP) thin-film surface mount packages. The packages are constructed using multi-layer LCP films and can be surface mounted on a printed circuit board (PCB). The package utilizes vias to connect the RF input from the PCB signal launch onto the package substrate. The use of an LCP enclosure provides near-hermetic capabilities in a compact structure. The receiver module consists of a low-noise amplifier (LNA), an image-rejection mixer and a driver amplifier. The surface mount package feedthrough simulation predicts better than 20 dB return loss up to 42 GHz. We show the conversion gain measurement of the receiver and derive a chart that explains sources of loss in the module. From the chart we discern that the package feedthrough loss is approximately 0.7 dB at 38.4 GHz.