• DocumentCode
    1971096
  • Title

    Exploring Fault-Tolerant Network-on-Chip Architectures

  • Author

    Park, Dongkook ; Nicopoulos, Chrysostomos ; Kim, Jongman ; Vijaykrishnan, N. ; Das, Chita R.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA
  • fYear
    2006
  • fDate
    25-28 June 2006
  • Firstpage
    93
  • Lastpage
    104
  • Abstract
    The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are rapidly becoming a force to be reckoned with. This spiraling trend highlights the importance of detailed analysis of these reliability hazards and the incorporation of comprehensive protection measures into all network-on-chip (NoC) designs. In this paper, we examine the impact of transient failures on the reliability of on-chip interconnects and develop comprehensive counter-measures to either prevent or recover from them. In this regard, we propose several novel schemes to remedy various kinds of soft error symptoms, while keeping area and power overhead at a minimum. Our proposed solutions are architected to fully exploit the available infrastructures in an NoC and enable versatile reuse of valuable resources. The effectiveness of the proposed techniques has been validated using a cycle-accurate simulator
  • Keywords
    fault tolerant computing; multiprocessor interconnection networks; network-on-chip; reliability; cycle-accurate simulator; deep submicron technology; fault-tolerant network-on-chip architecture; on-chip interconnect reliability; soft error symptoms; transient failures; Circuit faults; Clocks; Crosstalk; Fault tolerance; Hardware; Network-on-a-chip; Power system interconnection; Protection; Resource management; System recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Systems and Networks, 2006. DSN 2006. International Conference on
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    0-7695-2607-1
  • Type

    conf

  • DOI
    10.1109/DSN.2006.35
  • Filename
    1633499