Title :
Significance of electromagnetic coupling through vias in electronics packaging
Author :
Zhao, Jin ; Fang, Jiayuan
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
The investigation on the relative significance of electromagnetic coupling between vias and parallel traces is presented in this paper. This study shows that the coupling between vias can often be stronger than the coupling between traces and is therefore not negligible in signal integrity analysis of high-speed electronic packages.
Keywords :
packaging; electromagnetic coupling; high-speed electronic package; parallel trace; signal integrity analysis; via; Delay; Dielectric constant; Electromagnetic coupling; Electronics packaging; High-speed electronics; Impedance; Signal analysis; Strips; Transmission line matrix methods; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634056
