Implementation of a WLAN Front-End Module with a Power Amplifier

A compact RF front-end module for WLAN application is presented employing low temperature co-fired ceramic (LTCC) technology. It consists of a SiGe PA , a BPF for Rx, a LPF for Tx, and a matching circuit embedded in LTCC substrate. The total size of the module targeted is 4.5 mm x 3.2 mm x 1.4 mm. Measured results of the proposed module show an output power of 18 dBm and a gain of 27.8 dB in the Tx band with a 3.3 V supply. The measured adjacent-channel power ratios (ACPRs) at first side lobe and second side lobe are -31.1 dBc and -60.0 dBc at a 18 dBm output power. The insertion loss of LPF is less than 1 dB and BPF is less than 1.3dB. The measured 2nd harmonic of the module is -62 dBm at a 18 dBm output power.