Title :
Void and Pore Detections by the Scanning Near-Field Millimeter-Wave Microscopic Aperture Probe
Author :
Theerawisitpong, S. ; Suzuki, T. ; Negishi, T. ; Shibahara, K. ; Watanabe, Y.
Author_Institution :
Dept. of Electr. & Electron. Eng., Nippon Inst. of Technol., Miyashiro
Abstract :
To verify the defect on the material may be required for industrial application, such as void and pore detections. In our research, the scanning near-field millimeter-wave microscopy is used to detect the void and pore. In experiment, the voids are formed inside the Teflon sample with various in-depths from 0.5 mm to 10 mm. Each void is 1 mm-dia and 20 mm-length. The air void and water-filled void are recognized at in- depth of 2 mm. Another, the pores are on the surface of the TiO2 sheet with thickness of 2.4 mm. The 0.8 mm-depth pore is clearly recognized. The in-depth capability of void and pore detections has been proposed.
Keywords :
flaw detection; millimetre wave imaging; millimetre wave measurement; porosity; scanning probe microscopy; sheet materials; titanium compounds; Teflon sample; TiO2; air void; depth 0.5 mm to 10 mm; in-depth measurement; material defects; pore detection; scanning near-field millimeter-wave microscopic aperture probe; sheet surface; size 1 mm; size 20 mm; void detection; water-filled void; Apertures; Ceramics; Frequency; Image resolution; Microscopy; Millimeter wave measurements; Millimeter wave technology; Optical imaging; Probes; Rectangular waveguides; Scanning near-field millimeter-wave microscopy; in-depth measurement; microscopic aperture probe; millimeter-wave imaging; pore detection; scanning near-field microwave microscope (SNMM); void detection; waveguide-type microscopy;
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
DOI :
10.1109/APMC.2007.4554603
