Title :
Generation of the electrothermal Cauer RC model using a recursive method
Author :
Koh, Jeongwook ; Noebauer, Gerhard ; An, Chul
Author_Institution :
TU M¨unchen, Munich, Germany and Infineon Technologies AG, Munich, Germany
fDate :
11-13 September 2001
Keywords :
Circuit simulation; Coupling circuits; Electronic packaging thermal management; Electrothermal effects; Impedance; Mathematical model; Resistors; Temperature dependence; Topology; Transfer functions;
Conference_Titel :
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN :
2-914601-01-8
DOI :
10.1109/ESSDERC.2001.195309