Title :
Junction-to-Case Thermal Modeling and the Significance of the Junction Power Profile on Thermal Response
Author :
McShane, Erik A. ; Shenai, Krishna
Author_Institution :
University of Illinois, Chicago, USA
fDate :
11-13 September 2001
Keywords :
Circuit faults; Equivalent circuits; Impedance; MOSFETs; Packaging; Power dissipation; SPICE; Steady-state; Temperature; Thermal management;
Conference_Titel :
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN :
2-914601-01-8
DOI :
10.1109/ESSDERC.2001.195310
