• DocumentCode
    1972102
  • Title

    Modelling the Current Density and Resistance of Interconnect Vias

  • Author

    Reeves, G.K. ; Holland, A.S. ; Leech, P.W.

  • Author_Institution
    RMIT, Melbourne, Australia
  • fYear
    2001
  • fDate
    11-13 September 2001
  • Firstpage
    503
  • Lastpage
    506
  • Keywords
    Australia; Conductivity; Copper; Current density; Electric resistance; Finite element methods; Integrated circuit interconnections; Plugs; Ultra large scale integration; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 2001. Proceeding of the 31st European
  • Print_ISBN
    2-914601-01-8
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2001.195311
  • Filename
    1506693
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1972102