Title :
Defect-based compact model for circuit reliability simulation in advanced CMOS technologies
Author :
Esqueda, I.S. ; Barnaby, H.J.
Author_Institution :
Inf. Sci. Inst., Univ. of Southern California Arlington, Arlington, VA, USA
Abstract :
A defect-based compact modeling approach for circuit reliability simulation based on surface potential calculations is presented. The modeling approach captures the bias-dependence of stress-induced defects such as (bulk) oxide-trapped charge and interface traps that cannot be described by typical fixed voltage shift models (i.e., threshold voltage, Vth-based models). The defect dynamic charge contribution is modeled under non-equilibrium conditions and for all regions of operation (i.e. from weak to strong inversion) and not just at the threshold (as in Vth-based models). The modeled is verified with 2-D TCAD simulations that incorporate oxide trapped charge and interface trap densities. Spice-level simulations of ring oscillators and SRAM cells reveal inaccuracies in describing aging effects when utilizing typical fixed voltage shift models as compared to the presented defect-based compact modeling approach.
Keywords :
CMOS integrated circuits; SRAM chips; circuit simulation; integrated circuit reliability; oscillators; surface potential; technology CAD (electronics); 2D TCAD simulations; SPICE-level simulations; SRAM cells; advanced CMOS technologies; bias-dependence; bulk oxide-trapped charge traps; circuit reliability simulation; defect dynamic charge contribution; defect-based compact model; interface trap densities; ring oscillators; stress-induced defects; surface potential calculations; Aging; Electric potential; Integrated circuit modeling; Integrated circuit reliability; Semiconductor device modeling; Solid modeling; CMOS; Interface traps; NBTI; SRAM; aging; circuit simulation; reliability; ring oscillator; stress; surface potential;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4799-0350-4
DOI :
10.1109/IIRW.2013.6804155