Title :
Processing Requirements for Mass Production of Microwave Hybrid Integrated Circuits
Author :
Fache, M. ; Joly, J.
Author_Institution :
LIGNES TELEGRAPHIQUES & TELEPHONIQUES - Microwave Department - B.P. No 5 - 78702 - CONFLANS SAINTE HONORINE - France
Abstract :
The works undertaken by L.T.T. to master the different operations for low cost and mass production of MIC (in TO 8 package) components are described. A certain number of devices representative of the whole of microwave components one can realize in MIC technology were selected. They were used both for a comparative study of the explored technologies (from both technical and economical points of view) and for systematic reliability and reproductibility tests. The most performing technologies will be described in detail.
Keywords :
Bonding; Costs; Hybrid integrated circuits; Integrated circuit technology; Mass production; Microwave devices; Microwave integrated circuits; Microwave technology; Sputtering; Substrates;
Conference_Titel :
Microwave Conference, 1978. 8th European
Conference_Location :
Paris, France
DOI :
10.1109/EUMA.1978.332577
