Title :
Accurate characterization of board level interconnects for high performance systems
Author :
Lutz, R.D. ; Tripathi, A. ; Tripathi, V.K. ; Arabi, T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
Calibration and de-embedding techniques for time domain measurements associated with high speed off chip digital interconnects are presented. The techniques are demonstrated by measurements of skew, signal degradation, and crosstalk associated with typical interconnects in multilayered boards.
Keywords :
calibration; crosstalk; delays; equivalent circuits; packaging; printed circuit testing; time-domain reflectometry; board level interconnects; calibration techniques; crosstalk; de-embedding techniques; high performance systems; high speed off chip digital interconnects; interconnects; multilayered boards; signal degradation; skew; time domain measurements; Calibration; Connectors; Delay; Equivalent circuits; Integrated circuit interconnections; Probes; Time domain analysis; Time measurement; Timing; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634064
