DocumentCode
1973171
Title
Accurate characterization of board level interconnects for high performance systems
Author
Lutz, R.D. ; Tripathi, A. ; Tripathi, V.K. ; Arabi, T.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
171
Lastpage
174
Abstract
Calibration and de-embedding techniques for time domain measurements associated with high speed off chip digital interconnects are presented. The techniques are demonstrated by measurements of skew, signal degradation, and crosstalk associated with typical interconnects in multilayered boards.
Keywords
calibration; crosstalk; delays; equivalent circuits; packaging; printed circuit testing; time-domain reflectometry; board level interconnects; calibration techniques; crosstalk; de-embedding techniques; high performance systems; high speed off chip digital interconnects; interconnects; multilayered boards; signal degradation; skew; time domain measurements; Calibration; Connectors; Delay; Equivalent circuits; Integrated circuit interconnections; Probes; Time domain analysis; Time measurement; Timing; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634064
Filename
634064
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