DocumentCode
1973288
Title
Simulation of large packaged dense microwave circuits
Author
Petre, Peter ; Valley, George C. ; Kihm, Robert T. ; Gedney, Steplieit D.
Author_Institution
Hughes Res. Labs., Malibu, CA, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
191
Lastpage
194
Abstract
A new fast method of moments code is used to predict the performance and calculate the electromagnetic properties of packaged, dense, planar microwave circuits. It is demonstrated that circuits as large as transmit/receive (T/R) modules that cannot be simulated accurately with commercial tools can be modeled with this method.
Keywords
circuit analysis computing; method of moments; microwave circuits; packaging; transceivers; electromagnetic properties; large packaged dense planar microwave circuit; method of moments; simulation; transmit/receive module; Circuit simulation; Circuit testing; Electromagnetic coupling; Electromagnetic scattering; Electromagnetic waveguides; Electronics packaging; Equivalent circuits; Filters; Integrated circuit interconnections; Microwave circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634068
Filename
634068
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