Suppression of leakage and crosstalk in typical millimeter-wave flip-chip packages

Author

Lee, Gye-An ; Lee, Hai-Young

Author_Institution

Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon, South Korea

fYear

1997

fDate

27-29 Oct. 1997

Firstpage

195

Lastpage

198

Abstract

Leakage phenomena of flip-chip structures on common GaAs and alumina main substrates are characterized using the spectral domain approach to reduce the possible chip-to-chip crosstalk and transmission resonance. We have found that the longitudinal section magnetic mode is dominant for the coplanar waveguide leakage and the leakage can be suppressed by properly managing the gap height and the main substrate thickness in addition to the dielectric constant.

Keywords

coplanar waveguides; crosstalk; flip-chip devices; integrated circuit packaging; interference suppression; millimetre wave integrated circuits; spectral-domain analysis; Al/sub 2/O/sub 3/; GaAs; chip-to-chip crosstalk; coplanar waveguide leakage; dielectric constant; gap height; longitudinal section magnetic mode; millimeter-wave flip-chip package; spectral domain analysis; substrate thickness; transmission resonance; Coplanar waveguides; Crosstalk; Dielectric constant; Dielectric substrates; Electronics packaging; Frequency; Gallium arsenide; Integrated circuit interconnections; Magnetic domains; Magnetic resonance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Conference_Location

Austin, TX

Print_ISBN

0-7803-8649-3

Type

conf

DOI

10.1109/EPEP.1997.634069

Filename

634069