DocumentCode
1973470
Title
Research on EMC optimization of high speed PCB design
Author
Chen, Xi ; Xie, Shuguo ; Zhao, Mingmin ; Fu, Chengbin
Author_Institution
EMC Lab., Beihang Univ., Beijing, China
fYear
2011
fDate
16-18 Sept. 2011
Firstpage
6081
Lastpage
6084
Abstract
In This paper three optimization methods of ground design are used to solve EMI problems on the PCB mixed with both analog and digital signals. A model was built to test the surface current, E field, H field and S-parameters of the circuit board to consider the effect of these methods of avoiding EMI and SI problems. Then simulation experiments on a real product are carried out to show the improved performances after adopting these methods.
Keywords
circuit optimisation; electromagnetic compatibility; electromagnetic interference; printed circuit design; EMC optimization method; EMI problems; S-parameters; SI problems; analog signals; circuit board; digital signals; electromagnetic interference problems; high speed PCB design; Electromagnetic compatibility; Electromagnetic interference; Impedance; Integrated circuit modeling; Noise; Radio frequency; Surface impedance; EMC; EMI; SI; high_speed PCB layout; spilt ground;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Control Engineering (ICECE), 2011 International Conference on
Conference_Location
Yichang
Print_ISBN
978-1-4244-8162-0
Type
conf
DOI
10.1109/ICECENG.2011.6057058
Filename
6057058
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