DocumentCode :
1973592
Title :
Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging
Author :
Petre, P. ; Matloubian, M. ; Kihm, R.T. ; Gedney, S.D.
Author_Institution :
Hughes Res. Labs., Malibu, CA, USA
fYear :
1997
fDate :
27-29 Oct. 1997
Firstpage :
203
Lastpage :
206
Abstract :
This paper presents a descriptive study of the design and modeling of grounded coplanar waveguide (GCPW) and finite ground coplanar waveguide (FGCPW) circuits for microwave and millimeter wave applications. It is demonstrated that FGCPWs have a number of advantages over GCPW and microstrip, including that it easily accommodates flip chip packaging. It is also demonstrated that full-wave electromagnetic analysis tools can be used effectively to reduce the design cycle time of practical microwave circuit devices.
Keywords :
circuit analysis computing; coplanar waveguides; flip-chip devices; integrated circuit packaging; microwave integrated circuits; millimetre wave integrated circuits; passive networks; design; finite ground coplanar waveguide; flip chip packaging; full-wave electromagnetic analysis; grounded coplanar waveguide; microwave circuit; millimeter wave circuit; modeling; passive coplanar waveguide device; simulation; Circuit simulation; Coplanar waveguides; Electromagnetic analysis; Electromagnetic waveguides; Flip chip; Microstrip; Microwave circuits; Microwave devices; Millimeter wave circuits; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
Type :
conf
DOI :
10.1109/EPEP.1997.634071
Filename :
634071
Link To Document :
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