DocumentCode :
19737
Title :
An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method
Author :
Preibisch, Jan Birger ; Xiaomin Duan ; Schuster, Christian
Author_Institution :
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
Volume :
56
Issue :
4
fYear :
2014
fDate :
Aug. 2014
Firstpage :
980
Lastpage :
989
Abstract :
An efficient analysis using the contour integral method (CIM) for the modeling of inhomogeneous substrates with circular or arbitrarily shaped dielectric inclusions in planar structures is presented. It is shown how the segmentation method is applied to obtain circuit parameters as well as field values and how different boundary conditions can be implemented. Such an analysis is especially useful for the modeling of photonic crystals power/ground layers (PCPLs) in power delivery networks (PDNs) on printed circuit boards (PCBs). For circular inclusions, an analytical solution is presented, which improves efficiency and accuracy of the proposed method. An equivalent circuit model for cylindrical inclusions is derived, in order to obtain an effective capacitance for low frequencies and an estimate for parasitic effect at higher frequencies. It is shown how circular inclusions can be compared to decoupling capacitors on a basis of impedances. The method is validated with full-wave simulations showing a reduction in simulation time of about one order of magnitude.
Keywords :
equivalent circuits; inclusions; photonic crystals; printed circuits; substrates; CIM; PCBs; PCPLs; PDNs; analytical solution; arbitrarily shaped dielectric inclusions; circuit parameters; circular shaped dielectric inclusions; contour integral method; cylindrical inclusions; decoupling capacitors; equivalent circuit model; full-wave simulations; inhomogeneous substrate modelling; parasitic effect; photonic crystal power-ground layers; planar structures; power delivery networks; power-ground plane analysis; printed circuit boards; segmentation method; Computer integrated manufacturing; Impedance; Integrated circuit modeling; Nonhomogeneous media; Ports (Computers); Substrates; Transmission line matrix methods; Contour integral method (CIM); inhomogeneous substrate; photonic crystals power/ground layers (PCPL); printed circuit board (PCB); segmentation method;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2013.2292095
Filename :
6680732
Link To Document :
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