DocumentCode
19737
Title
An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method
Author
Preibisch, Jan Birger ; Xiaomin Duan ; Schuster, Christian
Author_Institution
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
Volume
56
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
980
Lastpage
989
Abstract
An efficient analysis using the contour integral method (CIM) for the modeling of inhomogeneous substrates with circular or arbitrarily shaped dielectric inclusions in planar structures is presented. It is shown how the segmentation method is applied to obtain circuit parameters as well as field values and how different boundary conditions can be implemented. Such an analysis is especially useful for the modeling of photonic crystals power/ground layers (PCPLs) in power delivery networks (PDNs) on printed circuit boards (PCBs). For circular inclusions, an analytical solution is presented, which improves efficiency and accuracy of the proposed method. An equivalent circuit model for cylindrical inclusions is derived, in order to obtain an effective capacitance for low frequencies and an estimate for parasitic effect at higher frequencies. It is shown how circular inclusions can be compared to decoupling capacitors on a basis of impedances. The method is validated with full-wave simulations showing a reduction in simulation time of about one order of magnitude.
Keywords
equivalent circuits; inclusions; photonic crystals; printed circuits; substrates; CIM; PCBs; PCPLs; PDNs; analytical solution; arbitrarily shaped dielectric inclusions; circuit parameters; circular shaped dielectric inclusions; contour integral method; cylindrical inclusions; decoupling capacitors; equivalent circuit model; full-wave simulations; inhomogeneous substrate modelling; parasitic effect; photonic crystal power-ground layers; planar structures; power delivery networks; power-ground plane analysis; printed circuit boards; segmentation method; Computer integrated manufacturing; Impedance; Integrated circuit modeling; Nonhomogeneous media; Ports (Computers); Substrates; Transmission line matrix methods; Contour integral method (CIM); inhomogeneous substrate; photonic crystals power/ground layers (PCPL); printed circuit board (PCB); segmentation method;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2013.2292095
Filename
6680732
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