• DocumentCode
    19737
  • Title

    An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method

  • Author

    Preibisch, Jan Birger ; Xiaomin Duan ; Schuster, Christian

  • Author_Institution
    Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
  • Volume
    56
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    980
  • Lastpage
    989
  • Abstract
    An efficient analysis using the contour integral method (CIM) for the modeling of inhomogeneous substrates with circular or arbitrarily shaped dielectric inclusions in planar structures is presented. It is shown how the segmentation method is applied to obtain circuit parameters as well as field values and how different boundary conditions can be implemented. Such an analysis is especially useful for the modeling of photonic crystals power/ground layers (PCPLs) in power delivery networks (PDNs) on printed circuit boards (PCBs). For circular inclusions, an analytical solution is presented, which improves efficiency and accuracy of the proposed method. An equivalent circuit model for cylindrical inclusions is derived, in order to obtain an effective capacitance for low frequencies and an estimate for parasitic effect at higher frequencies. It is shown how circular inclusions can be compared to decoupling capacitors on a basis of impedances. The method is validated with full-wave simulations showing a reduction in simulation time of about one order of magnitude.
  • Keywords
    equivalent circuits; inclusions; photonic crystals; printed circuits; substrates; CIM; PCBs; PCPLs; PDNs; analytical solution; arbitrarily shaped dielectric inclusions; circuit parameters; circular shaped dielectric inclusions; contour integral method; cylindrical inclusions; decoupling capacitors; equivalent circuit model; full-wave simulations; inhomogeneous substrate modelling; parasitic effect; photonic crystal power-ground layers; planar structures; power delivery networks; power-ground plane analysis; printed circuit boards; segmentation method; Computer integrated manufacturing; Impedance; Integrated circuit modeling; Nonhomogeneous media; Ports (Computers); Substrates; Transmission line matrix methods; Contour integral method (CIM); inhomogeneous substrate; photonic crystals power/ground layers (PCPL); printed circuit board (PCB); segmentation method;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2013.2292095
  • Filename
    6680732