DocumentCode
1973798
Title
Buried double bondwires for microwave hermetic packages
Author
Kim, Sung-Jin ; Lee, Hai-Young
Author_Institution
Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon, South Korea
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
209
Lastpage
212
Abstract
Double bondwires buried in a dielectric material is proposed for high frequency hermetic packages and characterized experimentally and theoretically up to 30 GHz. These buried bondwires made it possible to achieve 15 dB improvement of return loss at 20 GHz compared to conventional bondwires.
Keywords
integrated circuit packaging; lead bonding; microwave integrated circuits; 20 to 30 GHz; buried double bondwire; dielectric material; microwave hermetic package; return loss; Bonding; Dielectric measurements; Electronics packaging; Frequency; Insertion loss; MMICs; Message-oriented middleware; Microwave devices; Scattering parameters; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634072
Filename
634072
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