• DocumentCode
    1974086
  • Title

    Integrated design using SMT

  • Author

    Blackwell, Glenn R.

  • Author_Institution
    Electr. Eng. Technol., Purdue Univ., West Lafayette, IN, USA
  • Volume
    3
  • fYear
    1999
  • fDate
    10-13 Nov. 1999
  • Abstract
    The electronics manufacturing technique known as surface mount technology (SMT) is both a challenge and an opportunity to electrical and electronic academic programs. It is a challenge because lab-oriented EE and EET courses will be forced to use SMT as fewer and fewer parts will be available in traditional through-hole technology (THT). It is an opportunity because the proper use of SMT requires knowledge not only of electronics and/or software design, but also of printed circuit board layout issues, thermal properties, stress and strain, phase diagrams and test techniques. This means that SMT can be used as a vehicle to integrate the teaching of these topics for EE and EET students, providing encouragement for them to learn these topics. This paper discusses the manner in which these issues can be integrated in the academic environment, with consideration of both lecture and laboratory topics.
  • Keywords
    educational courses; electronic engineering education; laboratories; manufacture; student experiments; surface mount technology; SMT; electronic engineering education; electronic engineering technology; electronics manufacturing technique; laboratory-oriented courses; learning approaches; phase diagrams; printed circuit board layout; strain; stress; students; surface mount technology; teaching; test techniques; thermal properties; Capacitive sensors; Circuit testing; Electronic equipment testing; Manufacturing; Printed circuits; Software design; Software testing; Surface-mount technology; Thermal stresses; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference, 1999. FIE '99. 29th Annual
  • Conference_Location
    San Juan, Puerto Rico
  • ISSN
    0190-5848
  • Print_ISBN
    0-7803-5643-8
  • Type

    conf

  • DOI
    10.1109/FIE.1999.840475
  • Filename
    840475