• DocumentCode
    1974362
  • Title

    Dynamic Thermal Management for system-on-chip using bus arbitration

  • Author

    Srivathsa, Sudheendra K ; Suresh, Vikram B. ; Panchapakeshan, Pavan ; Kundu, Sandip

  • Author_Institution
    Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
  • fYear
    2010
  • fDate
    22-23 Nov. 2010
  • Firstpage
    372
  • Lastpage
    375
  • Abstract
    Increasing on-chip temperature in SoC designs has reinforced the need for Dynamic Thermal Management (DTM). The conventional DTM techniques adopted in microprocessors based on DVFS are not suitable in the context of SoCs as they tend to have multiple voltage and frequency domains. In this paper we propose a reactive and a predictive DTM technique using bus arbitration. Based on the thermal profile the bus grants and hence the bus transactions are controlled. This regulates the data flow which reduces the activity in the functional units. The results show that the on-chip temperature can be maintained 3-5°C below the chip temperature threshold with a worst case performance penalty of 5% and a fast response time of at most 5 clock cycles. The hardware cost of implementing the proposed scheme is 3619.7μm2 in 45 nm technology, which is less than 0.06% of the chip area. Apart from its simplicity, lower cost and effectiveness, the solution is non-intrusive on the design and scalable to many cores.
  • Keywords
    integrated circuit design; system-on-chip; thermal management (packaging); DVFS; SoC designs; bus arbitration; chip temperature threshold; data flow; dynamic thermal management; frequency domains; microprocessors; on-chip temperature; predictive DTM technique; reactive DTM techniques; size 45 nm; system-on-chip; temperature 3 degC to 5 degC; Clocks; Computer architecture; System-on-a-chip; Temperature sensors; Thermal management; Time factors; Arbiter; Bus; Dynamic Thermal Management; SoC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2010 International
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-8633-5
  • Type

    conf

  • DOI
    10.1109/SOCDC.2010.5682894
  • Filename
    5682894