DocumentCode
1974447
Title
A method for evaluating effect of package resonances on circuit performance [microstrip circuits]
Author
Cebi, Haki ; Gupta, K.C.
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
221
Lastpage
224
Abstract
A network modeling approach is used to estimate the effect of package resonance on performance of microstrip circuits. An example of two-stage MESFET amplifier illustrates the methodology developed.
Keywords
integrated circuit packaging; microstrip circuits; microwave amplifiers; microwave integrated circuits; resonance; circuit performance; internal EM fields; microstrip circuits; network modeling; package resonances; two-stage MESFET amplifier; Admittance; Circuit optimization; Coupling circuits; Electromagnetic fields; MESFET circuits; Magnetic separation; Microstrip; Packaging; RLC circuits; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634075
Filename
634075
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