DocumentCode :
1974494
Title :
An area efficient temperature sensor with software calibration for mobile application
Author :
Hwang, Wonsuk ; Yoo, Seoungjae ; Ko, Hyungjong ; Park, ByeongHa
Author_Institution :
Mixes Signal Core Design Team, Samsung Electron., Yongin, South Korea
fYear :
2010
fDate :
22-23 Nov. 2010
Firstpage :
349
Lastpage :
352
Abstract :
This paper presents an area-efficient temperature sensor with 1°C resolution based on a successive approximation algorithm. SoC requires several die temperature sensors to be integrated in a chip to manage the performance because die temperature directly affects leakage current level and performance of clock-based digital circuits. However, the size of temperatures sensor restricts the use of sensor in several places in a chip. The proposed area efficient temperature sensor uses only 0.13mm2 in Samsung 45nm CMOS process to obtain 1°C resolution in the range from -15°C to 125°C. For accurate temperature sensing, SAR type algorithm and software-based 2-point calibration method are adopted. After the 2-point calibration, the temperature sensor achieves 1°C resolution with ±2°C accuracy and the power consumption is 360uW in 1.8V.
Keywords :
CMOS digital integrated circuits; approximation theory; calibration; computerised instrumentation; leakage currents; system-on-chip; temperature sensors; 2-point calibration, method; CMOS process; SAR algorithm; SoC; area-efficient temperature sensor; clock-based digital circuits; die temperature sensors; leakage current level; mobile application; power 360 muW; power consumption; size 45 nm; software calibration; successive approximation register; system-on-chip; temperature -15 degC to 125 degC; voltage 1.8 V; Calibration; Software; Temperature dependence; Temperature measurement; Temperature sensors; Voltage control; software calibration; temperature sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SoC Design Conference (ISOCC), 2010 International
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-8633-5
Type :
conf
DOI :
10.1109/SOCDC.2010.5682900
Filename :
5682900
Link To Document :
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