• DocumentCode
    1974494
  • Title

    An area efficient temperature sensor with software calibration for mobile application

  • Author

    Hwang, Wonsuk ; Yoo, Seoungjae ; Ko, Hyungjong ; Park, ByeongHa

  • Author_Institution
    Mixes Signal Core Design Team, Samsung Electron., Yongin, South Korea
  • fYear
    2010
  • fDate
    22-23 Nov. 2010
  • Firstpage
    349
  • Lastpage
    352
  • Abstract
    This paper presents an area-efficient temperature sensor with 1°C resolution based on a successive approximation algorithm. SoC requires several die temperature sensors to be integrated in a chip to manage the performance because die temperature directly affects leakage current level and performance of clock-based digital circuits. However, the size of temperatures sensor restricts the use of sensor in several places in a chip. The proposed area efficient temperature sensor uses only 0.13mm2 in Samsung 45nm CMOS process to obtain 1°C resolution in the range from -15°C to 125°C. For accurate temperature sensing, SAR type algorithm and software-based 2-point calibration method are adopted. After the 2-point calibration, the temperature sensor achieves 1°C resolution with ±2°C accuracy and the power consumption is 360uW in 1.8V.
  • Keywords
    CMOS digital integrated circuits; approximation theory; calibration; computerised instrumentation; leakage currents; system-on-chip; temperature sensors; 2-point calibration, method; CMOS process; SAR algorithm; SoC; area-efficient temperature sensor; clock-based digital circuits; die temperature sensors; leakage current level; mobile application; power 360 muW; power consumption; size 45 nm; software calibration; successive approximation register; system-on-chip; temperature -15 degC to 125 degC; voltage 1.8 V; Calibration; Software; Temperature dependence; Temperature measurement; Temperature sensors; Voltage control; software calibration; temperature sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2010 International
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-8633-5
  • Type

    conf

  • DOI
    10.1109/SOCDC.2010.5682900
  • Filename
    5682900