• DocumentCode
    1975435
  • Title

    Effects of high oxygen-affinity elements on microstructure of Cu-Cr alloy ingots

  • Author

    Jianrong Gao ; Shixi Liu ; Xiaojun Wang ; Wenbin Wang

  • Author_Institution
    Key Lab. of Electromagn. Process. of Mater. (Minist. of Educ.), Northeastern Univ., Shenyang, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Cu-Cr alloys with additions of high oxygen affinity elements C, Al, La, Ti and Zr were inductively melted and cast in an alumina crucible. Microstructure of the as-cast ingots was investigated using an optical microscope and a scanning electron microscope. The ingots with low Cr contents solidify into a dendritic microstructure, whereas those with high Cr content solidify into a droplet-shaped microstructure due to the occurrence of liquid phase separation before solidification. The additions of these elements reduce the amount of oxide inclusions generally, and alter the morphology of the oxide inclusions as well. However, they produced different effects on the liquid miscibility gap of high Cr alloys. The additions of Al, Ti and La tend to reduce the miscibility gap, whereas the addition of C tends to broaden the miscibility gap. These changes in the microstructure were discussed with respect to the performance of the Cu-Cr contact material.
  • Keywords
    chromium alloys; copper alloys; crystal morphology; dendritic structure; inclusions; ingots; optical microscopy; phase separation; scanning electron microscopy; solidification; solubility; Cu-Cr alloy ingots microstructure; Cu-Cr contact material; CuCr; dendritic microstructure; droplet shaped microstructure; high oxygen affinity element effect; liquid miscibility gap; liquid phase separation; optical microscope; oxide inclusions morphology; scanning electron microscope; solidification; Contacts; Liquids; Metals; Microstructure; Morphology; Zirconium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Power Equipment - Switching Technology (ICEPE-ST), 2013 2nd International Conference on
  • Conference_Location
    Matsue
  • Type

    conf

  • DOI
    10.1109/ICEPE-ST.2013.6804309
  • Filename
    6804309