DocumentCode :
1975514
Title :
Improving the Coupling Characteristics of Bandpass Filters by Using Multilayer Structure and Defect Ground Units
Author :
Chen, Wu-Nan ; Chia, Wei-Kuo ; Yang, Cheng-Fu ; Shih, Chih-Liang
Author_Institution :
Dept. of Comput. & Commun., SHU-TE Univ., Taipei
fYear :
2007
fDate :
11-14 Dec. 2007
Firstpage :
1
Lastpage :
3
Abstract :
This paper proposes a novel multi-layer microstrip 2.4 GHz bandpass filter fabricated on two bonded substrates. The multi-layer filter has a symmetrically-bent, open-loop, square- ring stepped impedance resonator (SIR) structure on the top surface of the upper substrate, a similar SIR pattern rotated through 90deg on the lower surface of the upper substrate, and a pair of L-shaped symmetrical defected ground units on the bottom surface of the lower substrate. The simulation results demonstrate that the multi-layer structure improves the electromagnetic coupling characteristics of the bandpass filter and increases both the return loss by more than 30 dB at the center frequency compared to that achieved using a conventional two-layer (SIR-ground) structure, hi addition, the defected ground units etched onto the metallic ground plane beneath the feed lines yield a significant reduction in the spurious harmonics at a frequency of 5.2 GHz. Experimental results are presented to show the performance of the proposed filters.
Keywords :
band-pass filters; electromagnetic coupling; microstrip filters; resonators; bandpass filter; defect ground unit; electromagnetic coupling characteristic; frequency 2.4 GHz; frequency 5.2 GHz; multilayer microstrip filter; stepped impedance resonator; Band pass filters; Bonding; Electromagnetic coupling; Etching; Feeds; Frequency; Microstrip filters; Nonhomogeneous media; Resonator filters; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
Type :
conf
DOI :
10.1109/APMC.2007.4554780
Filename :
4554780
Link To Document :
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