DocumentCode
1975626
Title
Simulation and Behavior Evaluation of PT-IGBT Connections in Parallel Strings
Author
Chimento, F. ; Nicosia, F. ; Musumeci, S. ; Raciti, A. ; Melito, M. ; Sorrcntino, G.
Author_Institution
Univ. of Catania, Catania
fYear
2007
fDate
4-7 June 2007
Firstpage
931
Lastpage
936
Abstract
The paper deals with the experimental evaluation of the electrical and thermal behaviors of punch-through IGBT in parallel connections. The influences of the electrical parameters on the current sharing are evaluated and discussed. The thermal behavior of several ICBT devices in parallel connections in different experimental conditions are evaluated and discussed. Furthermore some issues on the negative feedback contribution coming from the heat sink looking for the reduction of the current imbalance are analyzed in loaded conditions.
Keywords
feedback; heat sinks; insulated gate bipolar transistors; power bipolar transistors; current imbalance; current sharing; electrical behavior; heat sink; negative feedback; parallel strings; punch-through IGBT connections; thermal behavior; Circuit simulation; Circuit testing; Current control; Heat sinks; Insulated gate bipolar transistors; Negative feedback; Production; Steady-state; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location
Vigo
Print_ISBN
978-1-4244-0754-5
Type
conf
DOI
10.1109/ISIE.2007.4374722
Filename
4374722
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