DocumentCode
1976044
Title
Performance maximization of 3D-stacked cache memory on DVFS-enabled processor
Author
Kang, Kyungsu ; Jung, Jongpil ; Kyung, Chong-Min
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., KAIST, Daejeon, South Korea
fYear
2010
fDate
22-23 Nov. 2010
Firstpage
47
Lastpage
50
Abstract
3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.
Keywords
cache storage; logic design; microprocessor chips; three-dimensional integrated circuits; 3D stacked cache memory; DVFS enabled processor; cache memory stacking; chip integration density; dynamic frequency scheduling; dynamic voltage scheduling; energy consumption; performance maximization; processor core; Benchmark testing; Cache memory; Clocks; Energy consumption; Equations; Mathematical model; Three dimensional displays; 3D IC; DVFS; cache; energy; performance; temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2010 International
Conference_Location
Seoul
Print_ISBN
978-1-4244-8633-5
Type
conf
DOI
10.1109/SOCDC.2010.5682975
Filename
5682975
Link To Document