• DocumentCode
    1976044
  • Title

    Performance maximization of 3D-stacked cache memory on DVFS-enabled processor

  • Author

    Kang, Kyungsu ; Jung, Jongpil ; Kyung, Chong-Min

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., KAIST, Daejeon, South Korea
  • fYear
    2010
  • fDate
    22-23 Nov. 2010
  • Firstpage
    47
  • Lastpage
    50
  • Abstract
    3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.
  • Keywords
    cache storage; logic design; microprocessor chips; three-dimensional integrated circuits; 3D stacked cache memory; DVFS enabled processor; cache memory stacking; chip integration density; dynamic frequency scheduling; dynamic voltage scheduling; energy consumption; performance maximization; processor core; Benchmark testing; Cache memory; Clocks; Energy consumption; Equations; Mathematical model; Three dimensional displays; 3D IC; DVFS; cache; energy; performance; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2010 International
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-8633-5
  • Type

    conf

  • DOI
    10.1109/SOCDC.2010.5682975
  • Filename
    5682975