Title :
Generating reduced order models via PEEC for capturing skin and proximity effects
Author :
Kamon, Mattan ; Marques, Nuno ; Silveira, L. Miguel ; White, Jacob
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
Abstract :
In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in generating low order models when PEEC-like models include volume filaments to accurately capture skin and proximity effects.
Keywords :
equivalent circuits; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; matrix algebra; skin effect; transmission line theory; 3D PEEC interconnect models; low order models; model order reduction; partial element equivalent circuit; proximity effect; reduced order models; skin effect; volume filaments; Admittance; Circuit simulation; Computational modeling; Conductors; Equivalent circuits; Integrated circuit interconnections; Jacobian matrices; Proximity effect; Skin; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634084
