Generating reduced order models via PEEC for capturing skin and proximity effects

Author

Kamon, Mattan ; Marques, Nuno ; Silveira, L. Miguel ; White, Jacob

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

fYear

1997

fDate

27-29 Oct. 1997

Firstpage

259

Lastpage

262

Abstract

In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in generating low order models when PEEC-like models include volume filaments to accurately capture skin and proximity effects.

Keywords

equivalent circuits; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; matrix algebra; skin effect; transmission line theory; 3D PEEC interconnect models; low order models; model order reduction; partial element equivalent circuit; proximity effect; reduced order models; skin effect; volume filaments; Admittance; Circuit simulation; Computational modeling; Conductors; Equivalent circuits; Integrated circuit interconnections; Jacobian matrices; Proximity effect; Skin; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Conference_Location

Austin, TX

Print_ISBN

0-7803-8649-3

Type

conf

DOI

10.1109/EPEP.1997.634084

Filename

634084

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1976221