DocumentCode
1976565
Title
Design of a miniaturized balun using Low Temperature Co-fired Ceramic Technology
Author
Wan-Bing, Jiang ; Long, Jin ; Ji-gang, Hu ; Shi-zhao, Yang
Author_Institution
Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2010
fDate
7-9 Dec. 2010
Firstpage
1
Lastpage
4
Abstract
This paper presents a novel miniaturized balun using Low Temperature Co-fired Ceramic (LTCC) Technology. Lumped capacitors are employed in the balun, so that the electrical length of the coupled line can be reduced greatly compared to conventional Marchand balun. The even-odd mode method is used to analyze it, and a novel three dimensional (3D) structure is presented. A spiral broadside coupled strip-line is adopted to realize the proposed miniaturized multi-layer balun. The proposed balun achieves ±0.1dB amplitude balance and ±0.5° phase balance, with over 20 dB return loss from 2.4 GHz to 2.5 GHz, which can be widely used as a standard component in wireless communication.
Keywords
baluns; capacitors; ceramic packaging; strip lines; LTCC technology; Marchand balun; even-odd mode method; frequency 2.4 GHz to 2.5 GHz; low temperature co-fired ceramic technology; lumped capacitors; miniaturized balun design; miniaturized multilayer balun; return loss; spiral broadside coupled strip-line; three dimensional structure; wireless communication; Admittance; Capacitance; Capacitors; Ceramics; Impedance; Impedance matching; Three dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location
Singapore
ISSN
2151-1225
Print_ISBN
978-1-4244-9068-4
Electronic_ISBN
2151-1225
Type
conf
DOI
10.1109/EDAPS.2010.5682998
Filename
5682998
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