• DocumentCode
    1976565
  • Title

    Design of a miniaturized balun using Low Temperature Co-fired Ceramic Technology

  • Author

    Wan-Bing, Jiang ; Long, Jin ; Ji-gang, Hu ; Shi-zhao, Yang

  • Author_Institution
    Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2010
  • fDate
    7-9 Dec. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a novel miniaturized balun using Low Temperature Co-fired Ceramic (LTCC) Technology. Lumped capacitors are employed in the balun, so that the electrical length of the coupled line can be reduced greatly compared to conventional Marchand balun. The even-odd mode method is used to analyze it, and a novel three dimensional (3D) structure is presented. A spiral broadside coupled strip-line is adopted to realize the proposed miniaturized multi-layer balun. The proposed balun achieves ±0.1dB amplitude balance and ±0.5° phase balance, with over 20 dB return loss from 2.4 GHz to 2.5 GHz, which can be widely used as a standard component in wireless communication.
  • Keywords
    baluns; capacitors; ceramic packaging; strip lines; LTCC technology; Marchand balun; even-odd mode method; frequency 2.4 GHz to 2.5 GHz; low temperature co-fired ceramic technology; lumped capacitors; miniaturized balun design; miniaturized multilayer balun; return loss; spiral broadside coupled strip-line; three dimensional structure; wireless communication; Admittance; Capacitance; Capacitors; Ceramics; Impedance; Impedance matching; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
  • Conference_Location
    Singapore
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4244-9068-4
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2010.5682998
  • Filename
    5682998