• DocumentCode
    1976631
  • Title

    Advanced model order reduction technique in real-life IC/package design

  • Author

    Peng, Zhen ; Shao, Yang ; Lee, Jin-Fa

  • Author_Institution
    Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
  • fYear
    2010
  • fDate
    7-9 Dec. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
  • Keywords
    Galerkin method; computational complexity; frequency response; integrated circuit modelling; integrated circuit packaging; matrix multiplication; MGAWE; MOR technique; advanced model order reduction technique; computational complexity; electromagnetic simulation; fast frequency sweep process; matrix-vector multiplications; multipoint Galerkin asymptotic waveform evaluation; multiport excitation; multiport multifrequency responses; multiport system; real-life 3D full package signal integrity analysis; real-life IC-package design; recycling Krylov subspaces method; Equations; Integrated circuit modeling; Mathematical model; Moment methods; Recycling; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
  • Conference_Location
    Singapore
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4244-9068-4
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2010.5683000
  • Filename
    5683000