DocumentCode
1976754
Title
Thin Film Transfer Components for Cheap MICs
Author
England, E.H.
Author_Institution
Department of Electrical and Electronic Engineering, Royal Military College of Science, Shrivenham, Swindon, SN6 8LA, England.
fYear
1979
fDate
17-20 Sept. 1979
Firstpage
646
Lastpage
650
Abstract
A solution to the problem of pattern definition, which sometimes exists in the production of cheap MICs, is described. The process (l) involves the transfer of high definition, thin film style, component patterns from a carrier to the main substrate. The concept allows common substrates to be tailored to individual requirements and promises the use of low cost MICs to be extended in frequency. The performance of components transferred into thick film and copper laminate style circuits is compared with wholly thin film constructed items.
Keywords
Copper; Costs; Frequency; Laminates; Microwave integrated circuits; Production; Substrates; Thick films; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1979. 9th European
Conference_Location
Brighton, UK
Type
conf
DOI
10.1109/EUMA.1979.332651
Filename
4131425
Link To Document