Title :
Conformal shielding investigation for SiP modules
Author :
Huang, Chun-Hsiang ; Hsiao, Chih-Ying ; Wang, Chuen-De ; Chen, Tonny ; Kuo-Hsien, Liao ; Wu, Tzong-Lin
Author_Institution :
Dept. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
This paper proposes a complete testing process for conformal shielding techniques. The testing process is systemic and cheap for developing conformal shielding techniques. A 2-D experiment setup and an exact solution are presented to evaluate the properties of metals and metallization techniques. A test vehicle is designed for providing broad band source and low unintended noise. A experiment setup using giga-hertz transverse electromagnetic (GTEM) cell is proposed for providing low noise floor and high sensitivity for measuring small radiation. The test vehicle coated by 0.04 μm sputtering SuS and 1 μm sputtering copper is manufactured and measured to evaluate shielding effectiveness of conformal shielding.
Keywords :
TEM cells; copper; integrated circuit metallisation; system-in-package; SiP modules; broad band source; conformal shielding techniques; gigahertz transverse electromagnetic cell; low noise floor; low unintended noise; metallization techniques; sputtering copper; Copper; Metallization; TEM cells; Transmission line measurements; Vehicles;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2010.5683022