Title :
A simple & cost-effective novel methodology for predicting SSN system performance for different PCB trace lengths
Author :
Ang, Chun Wooi ; Lo, Wei Wei ; Wong, Man On
Author_Institution :
Bayan Lepas Technoplex, Medan Bayan Lepas, Malaysia
Abstract :
High data rates, high clock speeds, and low power consumption are synonymous with advanced electronic devices. Consequently, simultaneous switching noise (SSN) is emerging as a critical side-effect of toggling signals within an electronic device because SSN affects signal integrity. Even minute changes in signal voltage in the order of a few millivolts can adversely affect the functioning of a circuit. A PCB typically forms the communication backbone between electronic components including field programmable gate array (FPGA) devices. Signal quality and SSN effects vary with PCB trace lengths. Traditionally, complex board models are used to simulate the SSN characteristics of electronic devices for different PCBs, which can be time consuming and expensive. This paper presents a cost-effective novel methodology for de-embedding the PCB trace effect to accurately characterize an FPGA device´s intrinsic SSN characteristics. The methodology uses simple and fast measurement and simulation techniques to de-embed the PCB trace effect for different PCB trace lengths. The predicted SSN data for different PCB trace lengths and intrinsic SSN data obtained using this methodology will be useful to FPGA system designers.
Keywords :
field programmable gate arrays; printed circuit design; printed circuits; FPGA device; FPGA system designer; PCB trace effect; PCB trace length; SSN system performance prediction; advanced electronic device; communication backbone; complex board model; critical side-effect; electronic component; field programmable gate array; high clock speed; high data rate; low power consumption; signal integrity; signal quality; simultaneous switching noise; Correlation; Equations; Mathematical model; Noise; Noise measurement; Scattering parameters; Transmission line measurements;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2010.5683031