DocumentCode :
1977412
Title :
A 60 GHz flip-chip bandpass filter in standard CMOS technology
Author :
Hou, Debin ; Xiong, Yong-Zhong ; Lim, Ying-Ying ; Goh, Wang Ling ; Li, Jiankang ; Lim, Teck Guan ; Hong, Wei
fYear :
2010
fDate :
7-9 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, a novel 60 GHz flip-chip bandpass filter in standard CMOS technology is proposed. An insertion loss of 0.69 dB/mm for microstrip line is obtained at 60 GHz by using cascaded THRU de-embedding method. By deploying the gap between the flip-chip bump and the flipped chip, an end-coupled, half-wavelength resonator filter is designed and fabricated. The measured insertion loss of 3.3 dB and return loss of >;13 dB with a bandwidth of 63% at centre frequency of 60 GHz clearly demonstrates that the proposed flip-chip filter is a promising candidate for 60 GHz integrated circuits applications.
Keywords :
CMOS integrated circuits; MMIC; band-pass filters; flip-chip devices; microstrip lines; resonator filters; cascaded THRU de-embedding method; flip-chip bandpass filter; flip-chip bump; frequency 60 GHz; half-wavelength resonator filter; integrated circuits applications; loss 3.3 dB; microstrip line; standard CMOS technology; Band pass filters; CMOS integrated circuits; Capacitance; Metals; Microstrip; Microwave filters; Resonator filters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
ISSN :
2151-1225
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2010.5683033
Filename :
5683033
Link To Document :
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