• DocumentCode
    1977412
  • Title

    A 60 GHz flip-chip bandpass filter in standard CMOS technology

  • Author

    Hou, Debin ; Xiong, Yong-Zhong ; Lim, Ying-Ying ; Goh, Wang Ling ; Li, Jiankang ; Lim, Teck Guan ; Hong, Wei

  • fYear
    2010
  • fDate
    7-9 Dec. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a novel 60 GHz flip-chip bandpass filter in standard CMOS technology is proposed. An insertion loss of 0.69 dB/mm for microstrip line is obtained at 60 GHz by using cascaded THRU de-embedding method. By deploying the gap between the flip-chip bump and the flipped chip, an end-coupled, half-wavelength resonator filter is designed and fabricated. The measured insertion loss of 3.3 dB and return loss of >;13 dB with a bandwidth of 63% at centre frequency of 60 GHz clearly demonstrates that the proposed flip-chip filter is a promising candidate for 60 GHz integrated circuits applications.
  • Keywords
    CMOS integrated circuits; MMIC; band-pass filters; flip-chip devices; microstrip lines; resonator filters; cascaded THRU de-embedding method; flip-chip bandpass filter; flip-chip bump; frequency 60 GHz; half-wavelength resonator filter; integrated circuits applications; loss 3.3 dB; microstrip line; standard CMOS technology; Band pass filters; CMOS integrated circuits; Capacitance; Metals; Microstrip; Microwave filters; Resonator filters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
  • Conference_Location
    Singapore
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4244-9068-4
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2010.5683033
  • Filename
    5683033