DocumentCode
1977445
Title
Performance analyse on millimetre-wave bonding-wire interconnection
Author
Li, Jiankang ; Xiong, Yong-Zhong ; Hu, Sanming ; Goh, Wang Ling ; Hou, Debin ; Wu, Wen
Author_Institution
Nanjing Univ. of Sci. & Technol., Nanjing, China
fYear
2010
fDate
7-9 Dec. 2010
Firstpage
1
Lastpage
4
Abstract
This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.
Keywords
MIMIC; integrated circuit bonding; integrated circuit interconnections; lead bonding; electrical model; loop height; millimetre-wave bonding-wire interconnection; wire length effect; Bonding; Capacitance; Gold; Inductance; Integrated circuit interconnections; Scattering parameters; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location
Singapore
ISSN
2151-1225
Print_ISBN
978-1-4244-9068-4
Electronic_ISBN
2151-1225
Type
conf
DOI
10.1109/EDAPS.2010.5683034
Filename
5683034
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