DocumentCode
1977519
Title
Design and Fabrication of an Infrared Microspectrometer using Attenuated Total Reflection
Author
de Graaf, G. ; van der Vlist, W. ; Wolffenbuttel, R.F.
Author_Institution
Delft Univ. of Technol., Delft
fYear
2007
fDate
4-7 June 2007
Firstpage
1395
Lastpage
1399
Abstract
This paper presents a concept for a fully integrated spectrometer system based on Attenuated Total Reflection. Operation is in the mid-infrared spectral range (lambda = 1.8 mum-5 mum). The approach allows micromachined integration of all critical components of the system: a thermal IR source, optical filtering, the ATR element, a detector array and a signal processing chip. Two bulk-micromachined silicon dies are used. The wideband light source and detector array for analysing the spectrum are fabricated in the bottom die. Polysilicon heaters on thin oxide- nitride bridges are used as the IR emitter and polysilicon thermocouples on thin membranes as IR detectors. The interaction between the sample and the evanescent field of the internally reflected IR beam takes place at the top die, which contains the bulk silicon ATR element Other optical components, required for defining the path of the IR light beam, like gratings, mirrors, transmission filters, Fresnel lenses and slits, can be fabricated on the top die also.
Keywords
infrared detectors; infrared spectroscopy; micromachining; microsensors; spectrometers; IR emitter; attenuated total reflection; bulk micromachined silicon die; detector array; evanescent field; fully integrated spectrometer; infrared microspectrometer; micromachined integration; optical filtering; polysilicon heater; polysilicon thermocouple; signal processing chip; thermal IR source; thin oxide- nitride bridg; wavelength 1.8 mum to 5 mum; wideband light source; Fabrication; Infrared detectors; Optical arrays; Optical devices; Optical filters; Optical reflection; Optical signal processing; Sensor arrays; Silicon; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location
Vigo
Print_ISBN
978-1-4244-0754-5
Electronic_ISBN
978-1-4244-0755-2
Type
conf
DOI
10.1109/ISIE.2007.4374805
Filename
4374805
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