Modeling the Leakage Current of Dielectric Isolation Structures in a High-Voltage Semiconductor Technology

System-in-package integration becomes more and more important in the growing market of micromechanical sensors and actuators. The most important group of actuators are those based on the electrostatic working principle. Because of the high voltages used to drive these actuators, new methods of isolation need to be introduced. In this paper we will characterize and model the electrical behavior of such an isolation technology. A simple device model to regard parasitic effects of this isolation during the process of circuit design will be introduced.