Teaching three-dimensional system-in-package design automation in a semester course

Author

Huang, Shih-Hsu ; Tu, Wen-Pin ; Yeh, Hua-Hsin ; Cheng, Chun-Hua

Author_Institution

Dept. of Electron. Eng., Chung Yuan Christian Univ., Chungli, Taiwan

fYear

2011

fDate

5-6 June 2011

Firstpage

52

Lastpage

55

Abstract

In recent years, three-dimensional (3D) system-in-package (SiP) has been widely recognized as a cost-effective alternative to system-on-chip (SoC). However, successful adoption of 3D SiP requires modifications to existing electronic design automation (EDA) tools to enable 3D SiP designs. Our previous courses focus on SoC design flow. Therefore, in our department, we develop a new course to offer students the concepts and experiences for 3D SiP design automation within a semester (18 weeks). Our teaching materials cover the overall 3D SiP design flow from front-end to back-end. Furthermore, during the course, students need to implement five computer-aided-design (CAD) tools for 3D SiP design automation. At the end of the semester, the evaluation of the course by students is very positive. Moreover, our students used the topic of 3D SiP design automation to participate in Taiwan IC/CAD contest, which is a national contest hosted by Ministry of Education of Taiwan, and won the first prize awards in recent two years.

Keywords

CAD; educational courses; electronic design automation; electronic engineering education; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D SiP design automation; EDA tools; SoC; computer-aided-design tools; course development; electronic design automation tools; semester course; system-on-chip; teaching; three-dimensional system-in-package design automation; Conferences; Design automation; Education; System-on-a-chip; Three dimensional displays; Through-silicon vias; computer-aided design; course development; electronic design automation; teaching experience; three-dimensional integrated circuits (3D ICs);

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Systems Education (MSE), 2011 IEEE International Conference on

Conference_Location

San Diego, CA

Print_ISBN

978-1-4577-0548-9

Electronic_ISBN

978-1-4577-0550-2

Type

conf

DOI

10.1109/MSE.2011.5937091

Filename

5937091