Title :
Low Threshold Current Operation of Stacked InAs/GaAs Quantum Dot Lasers with GaP Strain-Compensation Layers
Author :
Tatebayashi, J. ; Nuntawong, N. ; Xin, Y.C. ; Wong, P.S. ; Huang, S. ; Hains, C.P. ; Lester, L.F. ; Huffaker, D.L.
Author_Institution :
Center for High Technol. Mater., New Mexico Univ., Albuquerque, NM
Abstract :
We report the device characteristics of stacked InAs/GaAs quantum dots (QDs) with GaP strain compensation (SC) layers grown by metalorganic chemical vapor deposition. By inserting GaP SC layers within the stacked structures, decrease in the density of QDs by stacking QDs can be suppressed and the heterostructure interface between a p-clad and an active layer can be improved due to reduction of overall compressive strain within the stacked QDs. Ground-state lasing at a wavelength of 1.265 mum of six layers of InAs/GaAs QDs with GaP SC layers is demonstrated at a threshold current density of 108 A/cm2 . We also assess the internal loss and maximum modal gain of the fabricated QD lasers by using a segmented contact method. The internal loss is as low as 5 cm-1, and the maximum modal gain of the ground state of the stacked QDs is approximately 10 cm-1
Keywords :
III-V semiconductors; MOCVD; current density; gallium arsenide; ground states; indium compounds; laser variables measurement; optical losses; quantum dot lasers; semiconductor growth; 1.265 mum; GaP strain-compensation layers; InAs-GaAs; ground-state lasing; heterostructure interface; internal loss; metalorganic chemical vapor deposition; modal gain; segmented contact method; stacked InAs/GaAs quantum dot lasers; threshold current density; Capacitive sensors; Chemical lasers; Distributed feedback devices; Gallium arsenide; Laser feedback; MOCVD; Optical scattering; Quantum dot lasers; Threshold current; US Department of Transportation;
Conference_Titel :
Indium Phosphide and Related Materials Conference Proceedings, 2006 International Conference on
Conference_Location :
Princeton, NJ
Print_ISBN :
0-7803-9558-1
DOI :
10.1109/ICIPRM.2006.1634123