• DocumentCode
    1979781
  • Title

    A 500 fW/bit 14 fJ/bit-access 4kb standard-cell based sub-VT memory in 65nm CMOS

  • Author

    Meinerzhagen, Pascal ; Andersson, Oskar ; Mohammadi, Bahareh ; Sherazi, Yasser ; Burg, Andreas ; Rodrigues, Joachim Neves

  • Author_Institution
    Inst. of Electr. Eng., EPFL, Lausanne, Switzerland
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    Ultra-low power (ULP) biomedical implants and sensor nodes typically require small memories of a few kb, while previous work on reliable subthreshold (sub-VT) memories targets several hundreds of kb. Standard-cell based memories (SCMs) are a straightforward approach to realize robust sub-VT storage arrays and fill the gap of missing sub-VT memory compilers. This paper presents an ultra-low-leakage 4kb SCM manufactured in 65nm CMOS technology. To minimize leakage power during standby, a single custom-designed standard-cell (D-latch with 3-state output buffer) addressing all major leakage contributors of SCMs is seamlessly integrated into the fully automated SCM compilation flow. Silicon measurements of a 4kb SCM indicate a leakage power of 500fW per stored bit (at a data-retention voltage of 220 mV) and a total energy of 14 fJ per accessed bit (at energy-minimum voltage of 500mV), corresponding to the lowest values in 65nm CMOS reported to date.
  • Keywords
    CMOS memory circuits; biomedical electronics; flip-flops; low-power electronics; prosthetics; CMOS; D-latch; SCM compilation flow; custom-designed standard-cell; leakage power minimisation; sensor node; silicon measurement; size 65 nm; standard-cell based memory; standard-cell based subVT memory; subVT memory compiler; subVT storage array; ultra-low power biomedical implant; voltage 220 mV; Biomedical measurements; CMOS integrated circuits; Latches; Leakage current; Random access memory; Reliability; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ESSCIRC (ESSCIRC), 2012 Proceedings of the
  • Conference_Location
    Bordeaux
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4673-2212-6
  • Electronic_ISBN
    1930-8833
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2012.6341319
  • Filename
    6341319