Title :
High Refractive Index and Transparent Nanocomposites as Encapsulant for High Brightness LED Packaging
Author :
Yan Liu ; Ziyin Lin ; Xueying Zhao ; Chia-Chi Tuan ; Kyoung-sik Moon ; Sehoon Yoo ; Myoung-Gi Jang ; Ching-Ping Wong
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A high refractive index (RI) and transparent encapsulant material is in great demand for light emitting diode (LED) packaging to lower the RI contrasts between a LED chip and an encapsulant, and therefore improve the light extraction efficiency. In this paper, we prepared TiO2/silicone nanocomposites and studied the effects of the crystalline phases of TiO2, and the TiO2 surface modifications on their optical properties. The rutile TiO2 was found to be more effective to increase the RI of the nanocomposite than the anatase phase TiO2. At a 5 wt.% loading of TiO2, the RI was as high as 1.62 at the wavelength of 589 nm, which represents a significant improvement from 1.54 for silicone resin. In addition, surface modification was carried out using vinyl-terminated silane to improve the dispersion of nanoparticles in a silicone matrix, leading to a high relative transmittance of 84%. We also demonstrated that the optical property degradation of the nanocomposites in this paper was negligible after the accelerated reliability test.
Keywords :
encapsulation; light emitting diodes; nanocomposites; silicones; titanium compounds; LED chip; LED packaging; RI contrasts; TiO2-silicone nanocomposites; TiO2; accelerated reliability test; light emitting diode packaging; light extraction efficiency; nanoparticles; optical properties; refractive index; silicone matrix; surface modifications; transparent encapsulant material; vinyl-terminated silane; wavelength 589 nm; Light emitting diodes; Nanocomposites; Packaging; Polymers; Refractive index; Reliability; Encapsulation nanocomposites; light emitting diodes; refractive index;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2317413