Title :
Modeling and fabrication of electrospun polymer nanofibers with tailored architectures for tissue engineering scaffold applications
Author :
Wang, Yazhou ; Li, Hao ; Lee, James ; Yu, Qingsong ; Wang, Bochu ; Wang, Guixue
Author_Institution :
Dept. of Mech. & Aerosp. Eng., Univ. of Missouri, Columbia, MO
Abstract :
By using finite element method (FEM), nanofibers´ deposition behavior including the orientation and alignment of nanofibers that are approaching to fiber collectors was simulated and systematically investigated in term of the effects of electrostatic field. Based on the simulation results, we have experimentally demonstrated that Poly (epsiv-caprolactrone) (PCL) nanofibers with various disired patterns and ordered architectures can be prepared using predesigned fiber collectors. When cultured with mouse osteoblastic cell line (MC3T3-E1), it was found that the cells grew and elongated along the fiber orientation directions, and the results cellular organization and distribution mimicked the topological structures of the PCL nanofiber scaffolds. These results indicated that electrospun nanofiber scaffolds with tailored architechtures and patterns hold potential for engineering functional tissues or organs, where an ordered cellular organization is essential.
Keywords :
biology computing; electrospinning; finite element analysis; nanofibres; tissue engineering; and ordered architectures; electrospun polymer nanofiber scaffold; electrostatic field; engineering functional organs; engineering functional tissues; fiber collectors; fiber orientation direction; finite element method; mouse osteoblastic cell line; ordered cellular organization; tissue engineering scaffold application; topological structures; Bones; Dentistry; Fabrication; Finite element methods; Implants; Polymers; Resonance; Resonant frequency; Testing; Tissue engineering; Electrospinnin; cell morphology; finite element method; nanofibers; patterning; simulation; tissue engineering;
Conference_Titel :
Computational Intelligence for Measurement Systems and Applications, 2009. CIMSA '09. IEEE International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3819-8
Electronic_ISBN :
978-1-4244-3820-4
DOI :
10.1109/CIMSA.2009.5069954