DocumentCode :
1984562
Title :
Laser crack-free cutting technique for thick and dense ceramics
Author :
Ji, Lingfei ; Yan, Yinzhou ; Bao, Yong ; Jiang, Yijian
Author_Institution :
Inst. of Laser Eng., Beijing Univ. of Technol., Beijing, China
fYear :
2009
fDate :
30-3 Aug. 2009
Firstpage :
1
Lastpage :
2
Abstract :
A new laser crack-free cutting technique for dense ceramics with thickness of ges 10 mm based on beam continuous piercing full through the workpieces is presented. The techology can be concluded as a feasible tool for cutting of thick and dense ceramics in complex path, even for 3D cutting.
Keywords :
ceramics; laser beam cutting; 3D cutting; dense ceramic; laser crack free cutting technique; size 10 mm; thick ceramic; Aluminum oxide; Ceramics; Laser beam cutting; Laser modes; Optical materials; Optical pulses; Optical surface waves; Rough surfaces; Surface cracks; Surface roughness; crack-free; laser cutting; thick ceramics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers & Electro Optics & The Pacific Rim Conference on Lasers and Electro-Optics, 2009. CLEO/PACIFIC RIM '09. Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-3829-7
Electronic_ISBN :
978-1-4244-3830-3
Type :
conf
DOI :
10.1109/CLEOPR.2009.5292746
Filename :
5292746
Link To Document :
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