Building blocks for digital wireless communications in sub-micron technologies: an overview

Author

Finol, Jesus L. ; Durec, Jeffrey C. ; Lovelace, David K.

Author_Institution

Motorola Semicond. Products Sector, Tempe, AZ, USA

fYear

1998

fDate

2-4 Mar 1998

Firstpage

113

Lastpage

126

Abstract

This paper presents an overview of both the basic building blocks and process technologies associated with silicon ICs for personal wireless communications. The technical challenges to achieve higher levels of RF monolithic integration at a low cost and with low power dissipation in battery-powered portable transceivers are presented. Specific emphasis will be given to applications in the 1 to 2 GHz range of carrier frequencies

Keywords

digital integrated circuits; digital radio; elemental semiconductors; low-power electronics; mobile radio; monolithic integrated circuits; silicon; transceivers; 1 to 2 GHz; RF monolithic integration; Si; battery powered portable transceiver; building block; cost; personal digital wireless communication; power dissipation; silicon IC; submicron process technology; BiCMOS integrated circuits; CMOS technology; Communication standards; Communications technology; Costs; Integrated circuit technology; Monolithic integrated circuits; Radio frequency; Silicon; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Devices, Circuits and Systems, 1998. Proceedings of the 1998 Second IEEE International Caracas Conference on

Conference_Location

Isla de Margarita

Print_ISBN

0-7803-4434-0

Type

conf

DOI

10.1109/ICCDCS.1998.705818

Filename

705818