• DocumentCode
    1985220
  • Title

    PCB-MEMS Environmental Sensors in the Field

  • Author

    Broadbent, Heather A. ; Ivanov, Stanislav Z. ; Fries, David P.

  • Author_Institution
    Univ. of South Florida, Petersburg
  • fYear
    2007
  • fDate
    4-7 June 2007
  • Firstpage
    3282
  • Lastpage
    3286
  • Abstract
    Sensor networks for in-water measurements using Organic MEMS are progressing in our research effort. PCBMEMS enabled systems, primarily in Liquid Crystal Polymer material (LCP) have emerged from the laboratory and are operational in the field. The latest progress in sensor development has yielded PCBMEMS sensors operating in the field for extended periods. In addition, we have developed the multisensor system that measures conductivity, temperature, and pressure, and combined it with a 3D system-in-package wireless module based on the 802.11b protocol to create a salinity network node and an environmental network system. The power consumption, reliability and fouling of the fieldable sensors have been evaluated. Our results indicate that biofouling has become the limiting factor for sustained performance of the multisensor system within the environment.
  • Keywords
    electrical conductivity measurement; liquid crystal polymers; micromechanical devices; pressure measurement; sensors; temperature measurement; transport protocols; wireless LAN; 3D system-in-package wireless module; 802.11b protocol; Liquid Crystal Polymer material; Organic MEMS; PCB-MEMS environmental sensors; biofouling; conductivity measurement; environmental network system; fieldable sensors; in-water measurements; multisensor system; power consumption; pressure measurement; sensor networks; temperature measurement; Conducting materials; Conductivity measurement; Crystalline materials; Laboratories; Liquid crystal polymers; Micromechanical devices; Multisensor systems; Pressure measurement; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
  • Conference_Location
    Vigo
  • Print_ISBN
    978-1-4244-0754-5
  • Electronic_ISBN
    978-1-4244-0755-2
  • Type

    conf

  • DOI
    10.1109/ISIE.2007.4375141
  • Filename
    4375141