DocumentCode
1987653
Title
Low-voltage embedded RAMs in the nanometer era
Author
Kawahara, Takayuki
Author_Institution
Central Research Laboratory, Hitachi Ltd., Kokubunji Tokyo 185-8601, Japan. tkawaha@crl.hitachi.co.jp
fYear
2005
fDate
19-21 Dec. 2005
Firstpage
333
Lastpage
338
Abstract
Low-voltage nanometer-scale embedded RAM cells are described. First, low-voltage RAM cells are compared in terms of cell size, threshold voltage for MOS transistor, and signal charge. Second, the solution for 6T and 4T SRAM cells to widen the voltage margin are investigated, especially the advantages with a back-gate controlled thin buried-oxide fully-depleted SOI are presented. Then, DRAM approach with a novel twin- cell is discussed in terms of improving the retention time and low-voltage operation. These low-voltage cell technologies are the promising candidates for future embedded RAMs.
Keywords
CMOS technology; Circuits; Laboratories; Logic; Low voltage; MOSFETs; Power dissipation; Random access memory; Threshold voltage; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
Print_ISBN
0-7803-9339-2
Type
conf
DOI
10.1109/EDSSC.2005.1635275
Filename
1635275
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