• DocumentCode
    1987971
  • Title

    Technology CAD challenges of modeling multi-gate transistors

  • Author

    Weber, Charles ; Basu, Debdeep ; Kotlyar, Roza ; Morarka, Saurabh

  • Author_Institution
    Process Technol. Modeling, Intel Corp., Hillsboro, OR, USA
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    117
  • Lastpage
    118
  • Abstract
    As the economics of Moores law drives transistor feature scaling, multiple gate devices such as Tri-gate and FinFET transistors have been adopted to control short channel effects. As the device pitch is scaled, traditional strain engineering methods lose effectiveness and parasitics can increase, forcing technologists to evaluate disruptive solutions. Moreover, many local continuum models can no longer accurately describe device behaviour at these scaled dimensions and more advanced models must be adopted to guide process and device development. The challenges of present and future multi-gate device development and the role of technology computer aided design in addressing those challenges are discussed.
  • Keywords
    MOSFET; semiconductor device models; technology CAD (electronics); FinFET transistors; Moores law; device behaviour; device pitch; local continuum models; multigate device development; multigate transistors; multiple gate devices; process development; scaled dimensions; short channel effects; strain engineering methods; technology CAD challenges; technology computer aided design; transistor feature scaling; tri-gate transistors; Computational modeling; Doping; Logic gates; Predictive models; Silicon; Silicon germanium; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650588
  • Filename
    6650588