• DocumentCode
    1988043
  • Title

    Fast simulation of spin transfer torque devices in a general purpose TCAD device simulator

  • Author

    Heinz, F.O. ; Smith, Lee

  • Author_Institution
    Synopsys Schweiz GmbH, Zürich, Switzerland
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    We present integrated simulation of spin-transfer torque (STT) devices within the framework of a general purpose TCAD device simulator. A fast Airy function based approach is used to calculate spin and charge transport through magnetic tunnel junctions (MTJ). This enables direct mixed mode simulation of STT devices in a circuit environment - consisting of physical TCAD device models, SPICE-like compact models or a combination thereof - without first constructing a response surface model for the STT device. This was used to simulate a 4T-2MTJ non-volatile SRAM cell. For device interactions that are not captured in a circuit picture, STT and conventional devices may be combined in a single simulation geometry. Using an explicit exchange term in the Landau-Lifshitz-Gilbert equation allows capturing some aspects of spin dynamics beyond the macro-spin approximation.
  • Keywords
    SRAM chips; magnetic tunnelling; response surface methodology; semiconductor device models; technology CAD (electronics); 4T-2MTJ nonvolatile SRAM cell; Landau-Lifshitz-Gilbert equation; SPICE-like compact models; STT devices; charge transport; circuit environment; device interactions; direct mixed mode simulation; explicit exchange term; fast Airy function based approach; general purpose TCAD device simulator; integrated simulation; macro-spin approximation; magnetic tunnel junctions; physical TCAD device models; response surface model; single simulation geometry; spin dynamics; spin transfer torque devices; spin transport; Integrated circuit modeling; Magnetic tunneling; Magnetization; Mathematical model; Switches; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650591
  • Filename
    6650591