Frequency and Time Domain Analysis of Interconnections in Fast Logic Integrated Silicon Circuits

By an electromagnetic analysis in the frequency domain, we characterize the microstrip interconnecting lines in integrated silicon circuits. The propagation constant and characteristic impedance are given for several substrate conductivities. This conductivity is the origin of a dissipative and dispersive propagation. The analysis of the transmitted fast signals is treated by a Fourier transformation. We point out the main role played by the substrate losses on the time delay, the slew rate and the leading-edge on the output signals.