DocumentCode :
1989025
Title :
Grain growth and thermal stability of Ag thin films
Author :
Shugurov, A.R. ; Panin, A.V. ; Chun, H.-G. ; Loginov, B.
Author_Institution :
Inst. of Strength Phys. & Mater. Sci., SB RAS, Tomsk, Russia
fYear :
2005
fDate :
26 June-2 July 2005
Firstpage :
528
Lastpage :
531
Abstract :
The processes of grain growth and agglomeration into separate islands in sputtered Ag thin films subjected to thermal treatment are studied by scanning probe microscopy. Using an Arrhenius relation between the grain growth constant and annealing temperature, activation energy (0.40 eV) for the grain growth process is estimated. Close value (0.38 eV) is found for activation energy for the mass transport mechanism governing the film islanding. This indicates that surface diffusion is a key mass transport mechanism controlling plastic deformation of Ag thin films under annealing.
Keywords :
annealing; elemental semiconductors; grain growth; scanning probe microscopy; semiconductor thin films; silver; surface diffusion; thermal stability; 0.40 eV; Ag; Arrhenius relation; activation energy; annealing temperature; film islanding; grain growth; mass transport mechanism; plastic deformation; scanning probe microscopy; surface diffusion; thermal stability; thermal treatment; thin films; Annealing; Atomic force microscopy; Conductive films; Plastic films; Sputtering; Substrates; Surface topography; Temperature; Thermal stability; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Science and Technology, 2005. KORUS 2005. Proceedings. The 9th Russian-Korean International Symposium on
Print_ISBN :
0-7803-8943-3
Type :
conf
DOI :
10.1109/KORUS.2005.1507775
Filename :
1507775
Link To Document :
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