• DocumentCode
    1989086
  • Title

    Quartz resonant micro-structures as sensing elements for temperature sensors

  • Author

    Leblois, T.G. ; Tellier, C.R.

  • Author_Institution
    Ecole Nat. Superieure de Mecanique et des Microtech., Besancon, France
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1045
  • Abstract
    This paper describes the development of a temperature sensor based on a bulk acoustic waves micro-resonator vibrating in thickness shear mode. Two different cuts are chosen taking into account the thermal sensitivity, the electromechanical coupling factor, the trapped energy conditions. Care is also taken of technical problems caused by anisotropic chemical etching fabrication process. The active element of the structure is a circular thin plate suspended by four bridges micromachined in a NH4F.HF solution. The performances of resonators are tested in the range 20-100 C. Experimental results on Q factor and thermal sensitivity for our suspended resonators appear to be encouraging when compared with experimental values obtained with a bridgeless resonator and with theoretical results
  • Keywords
    Q-factor measurement; bulk acoustic wave devices; crystal resonators; electric sensing devices; etching; microsensors; temperature sensors; 20 to 100 C; NH4F-HF; NH4F.HF solution; Q factor; active element; anisotropic chemical etching fabrication; bridgeless resonator; bridges; bulk acoustic waves microresonator; circular thin plate; electromechanical coupling factor; quartz resonant microstructures; temperature sensors; thermal sensitivity; thickness shear mode; trapped energy; Acoustic waves; Anisotropic magnetoresistance; Bridges; Chemical elements; Chemical processes; Etching; Fabrication; Resonance; Temperature sensors; Thermal factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
  • Conference_Location
    Besancon
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-5400-1
  • Type

    conf

  • DOI
    10.1109/FREQ.1999.841484
  • Filename
    841484